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This article is part of the CPU socket series. LGA 1366 ( land grid array 1366), also known as Socket B, [2] [3] is an Intel CPU socket. This socket supersedes Intel's LGA 775 (Socket T) in the high-end and performance desktop segments. It also replaces the server-oriented LGA 771 (Socket J) in the entry level and is superseded itself by LGA 2011.
CPUs with a PGA (pin grid array) package are inserted into the socket and, if included, the latch is closed. CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands and ensuring a good connection, as well as ...
De Wikipedia, la enciclopedia encyclopedia. La matriz de contactos en rejilla o LGA (por sus siglas en inglés) es una interfaz de conexión a nivel físico para microprocesadores y circuitos integrados. Un socket o zócalo T ( LGA 775) en una placa base. A diferencia de las interfaces de matriz de rejilla de pines ( PGA) y matriz de rejilla de ...
Land Grid Array, FC -LGA) — тип корпуса микросхем, особенно процессоров, использующий матрицу контактных площадок, расположенную на корпусе микросхемы. Разъем для LGA-процессоров содержит массив ...
12 de oct. de 2021 · March 17, 2023 by Pratik. Land Grid Array (LGA) and Ball Grid Gray (BGA) are both Surface Mount Technologies (SMT) for motherboards. They define HOW the CPU will be mounted on the motherboard’s socket. Essentially, the most fundamental difference is that an LGA-based CPU can be plugged in and out of the motherboard and replaced.
Similar to one type of 80286[edit] One type of the 80286 CPU, most commonly 12 Mhz, used a single row of contact pads on all four edges. The chip was held against spring loaded contacts by a clip and a small heat sink. It was a very compact package compared to any other used for that CPU. I'd say that CLCC is a direct ancestor of the LGA.
FCPGA. "Flip-chip pin grid array"は、裸のインターポーザ上にフリップチップ実装したダイを樹脂封止し、周囲にピンを打ち込んだものである。. フリップチップ技術の実用化によって実現した。. 放熱のためのヒートシンクなどを外付けする場合に、他の形式では ...
