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1206 ( MCCVI) fue un año común comenzado en domingo del calendario juliano . Acontecimientos. 26 de marzo - Tratado de Cabreros, firmado por Alfonso IX de León y Alfonso VIII de Castilla. Temujin es proclamado Genghis Khan del pueblo Mongol, fundando el Imperio mongol.
June – King John ( Lackland) lands an expeditionary army at La Rochelle to defend his interests in Aquitaine, which is his from the inheritance from his mother, Queen Eleanor of Aquitaine. Meanwhile, French forces led by King Philip II ( Augustus) move south to meet John. The year's campaign ends in a stalemate and a two-year truce is made ...
- History
- Common Abbreviations
- Assembly Techniques
- Advantages
- Disadvantages
- Rework
- Packages
- Identification
- See Also
Surface-mount technology was developed in the 1960s. By 1986 surface mounted components accounted for 10% of the market at most, but was rapidly gaining popularity. By the late 1990s, the great majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices. Much of the pioneering work in this technology was done...
Different terms describe the components, technique, and machines used in manufacturing. These terms are listed in the following table:
Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process. It...
The main advantages of SMT over the older through-hole technique are: 1. Smaller components. 2. Much higher component density (components per unit area) and many more connections per component. 3. Components can be placed on both sides of the circuit board. 4. Higher density of connections because holes do not block routing space on inner layers, n...
SMT may be unsuitable as the sole attachment method for components that are subject to frequent mechanical stress, such as connectors that are used to interface with external devices that are frequ...SMDs' solder connections may be damaged by pottingcompounds going through thermal cycling.Manual prototype assembly or component-level repair is more difficult and requires skilled operators and more expensive tools, due to the small sizes and lead spacings of many SMDs.Handling of smal...Many types of SMT component packages cannot be installed in sockets, which provide for easy installation or exchange of components to modify a circuit and easy replacement of failed components. (Vi...Defective surface-mount components can be repaired by using soldering irons(for some connections), or using a non-contact rework system. In most cases a rework system is the better choice because SMD work with a soldering iron requires considerable skill and is not always feasible. Reworking usually corrects some type of error, either human- or mac...
Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. The electronics industry has standardized package shapes and sizes (the leading standardisation body is JEDEC).
Resistors
1. For 5% precision SMD resistors usually are marked with their resistance values using three digits: two significant digits and a multiplier digit. These are quite often white lettering on a black background, but other colored backgrounds and lettering can be used. For 1% precision SMD resistors, the code is used, as three digits would otherwise not convey enough information. This code consists of two digits and a letter: the digits denote the value's position in the E96 Seriesof values, whi...
Capacitors
1. Non-electrolytic capacitors are usually unmarked and the only reliable method of determining their value is removal from the circuit and subsequent measurement with a capacitance meter or impedance bridge. The materials used to fabricate the capacitors, such as nickel tantalate, possess different colours and these can give an approximate idea of the capacitance of the component.[citation needed] Generally physical size is proportional to capacitance and (squared) voltage for the same diele...
Inductors
1. Smaller inductance with moderately high current ratings are usually of the ferrite bead type. They are simply a metal conductor looped through a ferrite bead and almost the same as their through-hole versions but possess SMD end caps rather than leads. They appear dark grey and are magnetic, unlike capacitors with a similar dark grey appearance. These ferrite bead type are limited to small values in the nanohenry (nH) range and are often used as power supply rail decouplers or in high freq...
28 de mar. de 2024 · Category: Geography & Travel. Date: 1206 - 1368. Major Events: Battle of Legnica. Battle of Kulikovo. Battle of Mohi. Mongol Siege of Kaifeng. Key People: Genghis Khan. Kublai Khan. Giovanni da Pian del Carpini. Ogodei. Willem van Ruysbroeck. Related Places: China. Russia. Iran. Ukraine. Iraq. On the Web:
- The Editors of Encyclopaedia Britannica
1206 ( MCCVI) was a common year starting on Sunday of the Julian calendar, the 1206th year of the Common Era (CE) and Anno Domini (AD) designations, the 206th year of the 2nd millennium, the 6th year of the 13th century, and the 7th year of the 1200s decade. Events. Temujin becomes Genghis Khan of the Mongol people, he started the Mongol Empire.
German submarine U-1206 was a Type VIIC U-boat of Nazi Germany's Kriegsmarine during World War II. She was laid down on 12 June 1943 at F. Schichau GmbH in Danzig and went into service on 16 March 1944.
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