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Ventajas. Reduce el uso de plomo (elemento tóxico para el medio ambiente) al eliminar la necesidad de soldar elementos de interconexión. Reduce problemas derivados por la expansión térmica. Los terminales de pines y esferas de los PGA y BGA sufren dilataciones distintas al propio chip, que derivan en problemas cuando el conjunto alcanza ...
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA).
LGA 1200 is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake (10th gen) and Rocket Lake (11th-gen) desktop CPUs, which was released in April 2020. [1] [2] LGA 1200 is designed as a replacement for the LGA 1151 (known as Socket H4 ).
- Foxconn
- Intel
- May 27, 2020
LGA 1150, also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell microarchitecture. This socket is also used by the Haswell's successor, Broadwell microarchitecture.
- 1150
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- 2013
- 8 / 6
LGA 1155, also called Socket H2, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for their CPUs based on the Sandy Bridge (second generation core) and Ivy Bridge (third generation) microarchitectures. It is the successor of LGA 1156 (known as Socket H) and was itself succeeded by LGA 1150 in 2013.
Land Grid Array - Wikiwand. De Wikipedia, la enciclopedia libre. La matriz de contactos en rejilla o LGA (por sus siglas en inglés) es una interfaz de conexión a nivel físico para microprocesadores y circuitos integrados. Un socket o zócalo T ( LGA 775) en una placa base.
Land grid array: Fabricante: Intel: Datos técnicos; Dimensiones: 37.5mm × 37.5mm [1] Tipo de zócalo: LGA: Contactos: 1155: Procesadores; Sandy Bridge, Ivy Bridge: Cronología; LGA 1156
