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Land Grid Array. (Redirigido desde « Land grid array ») Un socket o zócalo T ( LGA 775) en una placa base. La matriz de contactos en rejilla 1 2 o LGA (por sus siglas en inglés) es una interfaz de conexión a nivel físico para microprocesadores y circuitos integrados. 3 . A diferencia de las interfaces de matriz de rejilla de pines ( PGA ...
Description. The land grid array is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used.
LGA 1200 is a land grid array mount with 1200 protruding pins to make contact with the pads on the processor. It uses a modified design of LGA 1151, with 49 more pins on it, improving power delivery and offering support for future incremental I/O features.
- Foxconn
- Intel
- May 27, 2020
LGA 775 (land grid array 775), also known as Socket T, is an Intel desktop CPU socket. Unlike PGA CPU sockets, such as its predecessor Socket 478, LGA 775 has no socket holes; instead, it has 775 protruding pins which touch contact points on the underside of the processor (CPU).
- 775
- Socket 478
Land Grid Array - Wikiwand. De Wikipedia, la enciclopedia libre. La matriz de contactos en rejilla o LGA (por sus siglas en inglés) es una interfaz de conexión a nivel físico para microprocesadores y circuitos integrados. Un socket o zócalo T ( LGA 775) en una placa base.
LGA 1155, also called Socket H2, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for their CPUs based on the Sandy Bridge (second generation core) and Ivy Bridge (third generation) microarchitectures.
This article is part of the CPU socket series. LGA 1150 features a Fully Integrated Voltage Regulator. LGA 1150, [1] also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell microarchitecture.