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  1. Hace 5 días · 64-bit processors: Intel 64 – Core microarchitecture Xeon (64-bit Core microarchitecture) Woodcrest – 65 nm process technology Server and Workstation CPU (SMP support for dual CPU system) Introduced June 26, 2006; Intel VT-x, multiple OS support; EIST (Enhanced Intel SpeedStep Technology) in 5140, 5148LV, 5150, 5160; Execute Disable Bit

  2. Hace 2 días · Ivy Bridge microarchitecture (3rd generation) 2013: Haswell microarchitecture (4th generation) 2014; 2015: Broadwell microarchitecture (5th generation) Skylake microarchitecture (6th generation) 2016; 2017: Kaby Lake microarchitecture (7th generation) Coffee Lake microarchitecture (8th generation) 2018; 2019; 2020: Comet Lake microarchitecture ...

  3. Hace 2 días · Ivy Bridge ( Tick) Successor (s) Broadwell (Tick/Process) Skylake (Tock) Support status. Unsupported. Haswell is the codename for a processor microarchitecture developed by Intel as the "fourth-generation core" successor to the Ivy Bridge (which is a die shrink / tick of the Sandy Bridge microarchitecture ). [1]

    • 2–4 (mainstream), 6–8 (enthusiast), 2–18 (Xeon)
    • June 4, 2013; 10 years ago
    • 0306C3h
    • x86-64
  4. Hace 4 días · LGA 1150, also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell microarchitecture. This socket is also used by the Haswell's successor, Broadwell microarchitecture.

  5. Hace 2 días · You can find our rankings of the most current-gen systems on the previous page. The results below are from our legacy benchmarks, using a different GPU and test systems than our current CPU benchmark

  6. Hace 6 días · Hillery C. Hunter, Jaime Moreno, Joel S. Emer, Daniel Sánchez: Proceedings of the 50th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2017, Cambridge, MA, USA, October 14-18, 2017. ACM 2017, ISBN 978-1-4503-4952-9.

  7. Hace 3 días · Proceedings of the 52nd Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2019, Columbus, OH, USA, October 12-16, 2019. ACM 2019, ISBN 978-1-4503-6938-1.