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  1. › wiki › Flip_chipFlip chip - Wikipedia

    Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.

  2. › wiki › Flip_MarkFlip Mark - Wikipedia

    Philip Mark Goldberg (born December 22, 1948), known professionally as Flip Mark, is an American former child actor. He was mostly active in the 1960s. Mark's first role was at the age of ten as "Flip Rhinelander" in the 1959 film The Journey , starring Yul Brynner and Deborah Kerr .

  3. 覆晶技術(英語: Flip Chip ),也稱“倒晶封裝”或“倒晶封裝法”,是晶片 封裝技術的一種。 此一封裝技術主要在於有別於過去晶片封裝的方式,以往是將晶片置放於基板(chip pad)上,再用打線技術(wire bonding)將晶片與基板上之連結點連接。